Applications
Overview of our applications
Nanoplas® - ETC coatings
Wear and corrosion protection, thermal insulation, electrical insulation, non-stick, gripping, running-in and gliding characteristics, special functional surfaces
ColdBond®-soldering of thermally sentive materials
The ColdBond technology offers the possibility to process thermally sensitive materials by means of low temperature soldering and sintering. Especially in the field of electronics, optics, sensor technology, medical technology and thermal management.
Metallization of surfaces
High-strength connections even at high operating temperatures - soldering in vacuum, under protective gas, with flame or induction.
Targets with Cu-Backing-Plates
Applications: Optical, elektronics, displays, glas, foils, solar, sensoric, decor, data storage, wear resistance, tribological systems
S-Bond® - Heat exchangers coldplates
A self-developed and patented soldering technique for athmospheric soldering and metallizing of metals, light metals, glasses and ceramics without flux.
High temperatur - hard brazing
High-strength connections, even at high operating temperatures - brazing in vacuum, under inert gas atmosphere, with a naked flame or induction.
Adhesive bonding
Alternative bonding possibility for high-strength bonds of metal-metal and metal-ceramic bonds.
Bodyclad® - Rough coatings
for gripping and cutting applications, machining, separating and grinding concrete, stone as well as hard surfaces