S-Bond® Soldering up to 450 °C

Heavy metal-free soldering acc. RoHS and WEEE with / without fluxing agent for the prevention of corrosion

S-Bond® Techinfo

Insight into ultrasonic soldering up to 450 °C.

Soldering offer

  • Soldering with Bi, In, Sn, Zn-based solders
  • Patented soft active soldering technology without using flux agents
  • Atmospheric and inert gas soldering processes:
    • light metals such as Al, Mg or Ti
    • metals and nonferrous metals
    • porous materials
    • magnetic materials
    • composites MMC and CMC
    • glasses and ceramics
    • ...
  • Production of wettable surfaces
  • Design of soldering appropriate assembly part constructions
  • Support in material selection
  • In-house construction and manufacturing of soldering auxiliary agents and appliances
  • Machines and equipments for ultrasonic soldering