Targets with Cu-Backing-Plates

Targets and crucibles for thin film technology

Applications: Optical, elektronics, displays, glas, foils, solar, sensoric, decor, data storage, wear resistance, tribological systems

Product description

Target materialsCeramics, metals, alloys, special materials on request
DesignPlanar, round (Rotatables), special geometries on request
Bonding serviceTargets with Cu-Backing-Plates
CruciblesTa, Mo, W

Info Center Targets

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On request targets with bonded cu-backing plates can be offered. As a standard solution targets are bonded with indium or brazed in vacuum furnaces. With SBond® bonding technique developed by Euromat® targets can be bonded up to about 250°C . The bonded targets can then thermally stressed up to about 175°C.