Soft-active-ultrasonic-soldering

S-Bond® Soldering up to 450 °C

S-Bond® soldering technology. An in-house developed and patented soldering technology for heavy metal-free soldering according to RoHS and WEEE without flux. Time-consuming component cleaning to remove flux residues is no longer necessary.

S-Bond® Techinfo

Insight into ultrasonic soldering up to 450 °C.

An exemplary application of ultrasonic soldering without flux on copper with our S-Bond® solder can be found on the following link:

S-Bond® Applications video

Insight into ultrasonic soldering of a copper plate

Soldering offer

Soldering with Bi, In, Sn, Zn-based solders
Patented soft active soldering technology without using flux agents
Atmospheric and inert gas soldering processes:
- light metals such as Al, Mg or Ti
- metals and nonferrous metals
- porous materials
- magnetic materials
- composites MMC and CMC
- glasses and ceramics
- ...

Production of wettable surfaces
Design of soldering appropriate assembly part constructions
Support in material selection
In-house construction and manufacturing of soldering auxiliary agents and appliances
Machines and equipments for ultrasonic soldering

Industrial Surface Solutions
Postanschrift - Postal Address
EUROMAT GmbH
Hermann-Hollerith-Strasse 6
D-52499 Baesweiler-Aachen/Germany

phone: +49 (0) 2401.6072.866
fax: +49 (0) 2401.6072.855
e-mail: input@euromat.de

Contact us

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