Targets with Cu-Backing-Plates
| Eigenschaft | Wert | Beschreibung | beschreibung_2 |
|---|---|---|---|
| Target materials | Ceramics, metals, alloys, special materials on request | ||
| Design | Planar, round (Rotatables), special geometries on request | ||
| Bonding service | Targets with Cu-Backing-Plates | ||
| Crucibles | Ta, Mo, W |
On request targets with bonded cu-backing plates can be offered. As a standard solution targets are bonded with indium or brazed in vacuum furnaces. With SBond® bonding technique developed by Euromat® targets can be bonded up to about 250°C . The bonded targets can then thermally stressed up to about 175°C.